For RPD, the failure rate and repair rate of software failure and human-induced failure are shown in Table 3. Combining with the overall hardware failure rate of the device, the time-varying failure rate and availability of the whole device after conside. For RPD, the failure rate and repair rate of software failure and human-induced failure are shown in Table 3. Combining with the overall hardware failure rate of the device, the time-varying failure rate and availability of the whole device after considering the temperature effect of RPD in series equivalence are shown in Fig. 3 and Fig. 4.According to the operation characteristics of each module, 10 modules were selected to be put into operation for 1–3 years, 4–6 years and 6–8 years respectively. Its internal temperature was measured with an infrared thermometer, Take the average of the working time and temperature of each module to obtain the approximate temperature of each module. For power modules, CPU modules, and other modules, taking into account the overall heat dissipation causes a certain temperature to rise or fall at the same time, or a single module drop or rise to a certain temperature because of different structural designs. Extreme cases are considered in this paper, and the temperature changes are all 1℃. The o.